Обратная связь
Extra Options
Intel® Xeon® D-2700 Processor (Ice Lake-D HCC) COM-HPC® Server Size D Module
Development Board for SMARC 2.0
Development Board for SMARC V2.0/V2.1.1 Pin-Out Modules
Development Board for Qseven R2.1 Modules
Development Board for ETX Modules
Development Board for COM Express® R2.1 Type 2 / 1 Modules
Development Board for COM Express® R2.1 Type 6 / 10 Modules
Development Board for COM Express® R3.0 Type 6 / 10 Modules
Development Board for COM Express® R3.0 Type 7 Modules
COM-HPC® Client Carrier for Size A, B and C Modules
COM-HPC® Server Carrier for Size D and Size E Modules
COM-HPC® Server Carrier for Size E (Proprietary)